Aluminum Foil Printed Bags for IC or Chips Packing
Model NO.: sky037
Bag Variety: Back Seal Bags
Size: as Per Cutomer′s Requiement
Thickness: Customized
Printing: Machine Printing
Color: Silver
Trademark: DIASAP
Transport Package: Carton
Specification: SGS RoHS report
Origin: Suzhou City, China
HS Code: 3923210000
Aluminum Foil Printed Bags for IC or Chips Packing
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This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.
This aluminum foil moisture proof bags are mainly applied to pack electronic components
(PCB, IC, HD driver)precise equipment and chemical raw material etc.
This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.
This laminated bag can print all symbols and can be customized according to customers' request.
This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.
 This aluminum foil moisture proof bags are mainly applied to pack electronic components
(PCB, IC, HD driver)precise equipment and chemical raw material etc.
This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.
This laminated bag can print all symbols and can be customized according to customers' request.
This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.
| Product Description | |
| Product Name | Aluminum Foil Printed Bags for IC or Chips Packing |
| Â Material Structure |
Layers Laminated Material: Â PET/AL/NY/PEÂ Â BOPP/AL/PE |
| Feature | Anti-static, moisture barrier,light isolation |
| Printing | Customized |
| Surface Resistance | 10^6~10^11 Ohm |
| Thickness | Customized(0.06--0.2mm available) |
| Bag Style | Open top/ zip lock/ envelope/ gusset/ three dimensional |
| Package | 50~100pcs per bag and then in cartons or as per customer's request |
| Â Usage |
Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc. |
Aluminum Foil Printed Bags for IC or Chips Packing Technical Parameters:
| NO. | Item | Standard | Result |
| 1 | Puncture Strength | MIL-STD-3010B | ≥24LBF |
| 2 | Surface resistivity | ASTM D-257 | 10^6-10^11ohm |
| 3 | Decay time | Â IEC61340-5-1 | <0.3s |
| 4 | WVTR | ASTM F1249 | ≤0.0006g/100in²/24hs |
| 5 | OTR | ASTM D3985 | ≤0.01cc/100in²/24hs |
| 6 | Heat-Seal Temperature |  | 160%±10% |
| 7 | Heat-Seal Pressure | Â | 70Pa |
| 8 | Heat-Seal Time |  | ≤1.5S |
Product Pictures:Â
Factory show:
 Factory show:
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